RF / High-Frequency PCB
Low‑Loss RF Circuit Solution
Request RF / High-Frequency PCB Fabrication QuoteHigh‑Frequency PCB (RF / Microwave PCB) is purpose‑built for high‑frequency and microwave signal transmission. Conventional FR‑4 suffers dielectric‑constant drift, heavy signal attenuation, severe EMI interference and phase shift under high‑frequency conditions. Built on low‑loss dielectrics, our HF PCBs cover mainstream operating bands of 500 MHz‑2 GHz and are extendable to millimeter‑wave spectrum. They fit high‑speed digital circuits, RF and microwave circuits and act as core substrates for wireless communication and RF devices.
Core Materials & Electrical Properties
HF‑PCB performance heavily relies on substrate selection. Dielectric constant (Er) directly governs impedance and signal behaviour. Rogers‑series laminates are industry favourites thanks to low dielectric loss, stable electrical performance and balanced cost. We stock key high‑frequency materials:
| Material | Dielectric Constant (@10GHz) |
| RO4350B | 3.48±0.05 |
| RO4003C | 3.38±0.05 |
| Ro3003 | 3.00±0.04 |
| Ro3010 | 10.2±0.03 |
| RT5880 | 2.20±0.02 |
Apart from Rogers, we support Taconic, Arlon, PTFE and other high‑frequency substrates. Trace width, spacing and dielectric thickness must be tightly defined at the design stage. Rigorous process controls ensure real‑world performance aligns with Gerber specifications.
Manufacturing Capability
All high‑frequency PCBs comply with IPC‑2 industrial quality grade. We support prototyping through large‑volume manufacturing.
| Item | Specification & Capability |
| Standard | IPC‑2 Industrial Grade |
| Max Layers | 2‑24 Layers |
| Order Volume | 1pc Prototype up to 10 000+ pcs Mass Production |
| Lead‑time | Samples: 2 days onwards; Mass production: up to 5 weeks |
| Main Substrates | RO4003C, RO4350B, Ro3003, Ro3010, RT5880 and other HF laminates |
| PP Prepreg | Rogers 4450F, Domestic 25FR, RF‑27, 6700 |
| Board Dimension | Min:6mm×6mm; Max:457mm×610mm |
| Board Thickness | 0.4mm‑5.0mm |
| Finished Copper Weight | 0.5oz‑2.0oz |
| Min Line Width / Space | 3mil/3mil |
| Solder Mask | Per Gerber requirement |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen | Per Gerber requirement |
| Silkscreen Color | White, Black, Yellow |
| Surface Finish (RoHS‑Compliant) | ENIG, Immersion Silver, Immersion Tin, OSP |
| Min Annular Ring | 4mil |
| Min Drill Hole | 6mil |
| Impedance Tolerance | ±10% |
| Optional Special Processes | Peel‑off mask, gold fingers, carbon ink, countersink holes |
Advantages & Applications
Our high‑frequency PCBs deliver stable dielectric constant, ultra‑low transmission loss, strong EMI immunity and outstanding phase consistency across operating frequencies, mitigating signal attenuation, distortion and crosstalk. Single‑layer, double‑layer and multi‑layer versions are offered with precise impedance control, trace‑length matching and custom dielectric thickness.
Major applications: 5G / 6G base stations, satellite navigation, microwave radar, RF antennas, wireless transmission equipment, high‑frequency test instruments, military communication hardware and IoT RF modules.
Support Service & Quality Control
Backed by solid experience in high‑frequency PCB manufacturing and RF‑oriented PCBA assembly, we tackle well‑known industry challenges including dielectric deviation, rough trace profile, impedance drift and excessive signal loss by refined process control, dedicated surface‑finish recipes and customized lamination schemes.
One‑stop PCBA service includes high‑frequency SMT assembly, precision RF‑component soldering and dedicated high‑frequency performance validation. Free pre‑sales engineering support covers substrate selection, stack‑up optimization, impedance matching and signal‑loss tuning to prevent design flaws and lift mass‑production yield.