Custom PCB Manufacturing for Prototype and Production

HDI PCB achieves advanced precision routing with laser drilling, micro blind & buried vias and fine‑line trace technology. Different from conventional through‑hole PCBs, HDI applies micro‑vias, fine line width & space and blind‑buried inter‑layer connections to greatly boost routing density. More functions can be realized within limited board dimensions to satisfy miniaturized multi‑functional electronic designs.

Supported technologies: 1‑order / 2‑order / any‑order blind‑buried vias, stacked vias, staggered vias, fine line‑width & space and precision impedance control. Key benefits: smaller hole dimension, higher routing density, efficient inter‑layer interconnection, stable signal transmission and better panel utilization. HDI helps reduce total layer count, lower device thickness, shorten signal path, mitigate crosstalk & signal loss and enhance overall system stability.

Main applications: smartphones, tablets, laptops, servers, high‑end smart‑home products, automotive smart terminals, precision industrial controllers and 5G communication terminals.

As an all‑in‑one HDI‑PCB & PCBA supplier, we deploy laser drilling machines, auto‑alignment exposure units and high‑precision AOI testers with full competence for high‑order HDI manufacturing. We accept urgent prototyping, pilot‑run and mass‑production orders. We tightly control micro‑via accuracy, line‑width tolerance, layer registration and impedance consistency to prevent open/short circuits, via blow‑out, trace shift and impedance deviation. Every HDI board undergoes full electrical testing, impedance validation and reliability burn‑in test to guarantee high yield for high‑precision products.

We deliver HDI‑oriented precision SMT assembly, supporting placement of ultra‑small 0201 / 01005 components and accurate BGA / QFN soldering, addressing the well‑known low‑yield challenge of high‑density board assembly. Free engineering support includes DFM audit, routing optimization, stack‑up tuning and process selection to eliminate design‑manufacturing risks.