Custom PCB Manufacturing for Prototype and Production

MCPCB (Metal‑Core PCB) is a high‑heat‑dissipation circuit board built on metallic base material. Main variants are aluminum substrate, copper substrate and iron‑base substrate, with aluminum LED substrate being the most popular. Unlike conventional dielectric‑base PCB, MCPCB features outstanding thermal conductivity, rapidly dissipating heat generated by components, lowering operating temperature and solving typical high‑power‑device pain‑points: overheating, heat accumulation, performance degradation and shortened service life.

MCPCB consists of three layers: metal base layer, high‑thermal‑conductivity dielectric layer and copper‑foil circuit layer. The dielectric layer is critical for heat transfer. We offer customizable thermal‑conductivity grades: 1.0W, 2.0W, 3.0W, 6.0W, 8.0W/(m·K) to match different power and heat‑dissipation requirements. Product strengths: fast heat dissipation, uniform thermal distribution, good heat resistance, high mechanical strength, anti‑deformation capability, reliable insulation and vibration resistance. Single‑sided, double‑sided and multi‑layer constructions are available with custom solder‑mask and surface‑finish options.

Key application fields: LED illumination, industrial lighting, automotive headlights, high‑power power modules, switching power supplies, inverters, charging piles, power amplifiers, motor‑drive modules and industrial high‑power thermal‑control equipment.

We are an integrated MCPCB & PCBA manufacturer, accepting prototype and mass‑production orders for aluminum‑base, copper‑base and iron‑base substrates. Custom options include special‑shape routing, slotting, ENIG, HASL and OSP. Production tightly controls dielectric‑layer thickness uniformity, trace adhesion and thermal‑layer integrity to avoid delamination, blistering, solder‑mask peeling and degraded thermal performance. Each production batch passes thermal‑performance verification, insulation‑withstand‑voltage test and aging test to guarantee heat‑dissipation performance and electrical safety. Our one‑stop service covers high‑power‑component SMT, post‑soldering, mechanical assembly and burn‑in testing.

According to your power rating, heat‑generation profile and mechanical mounting constraints, we recommend matching thermal‑conductivity grade, board thickness and copper weight. Free technical guidance includes heat‑dissipation optimization, structural revision and process selection.