Fine-pitch package assembly and inspection support for BGA, QFN, LGA and CSP components.
Fine-pitch package assembly and inspection support for BGA, QFN, LGA and CSP components.
Fine-pitch package assembly and inspection support for BGA, QFN, LGA and CSP components. The backend can be expanded with detailed material tables, delivery notes, drawings and project-specific engineering guidance.
Board data can be checked against material, thickness, copper, surface finish and special process requirements.
Fabrication content can connect with component sourcing, SMT, THT and test records.
Our team will review PCB, component and assembly requirements and respond with practical production guidance.